二甲氧基甲烷,Dimethoxymethane [DMM];absolute, over molecular sieve (H2O ≤0.01%), ≥99.0% (GC)
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多聚-L-赖氨酸氢溴酸盐 [多聚赖氨酸],Poly-L-lysine hydrobromide;mol wt ≥300,000
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氧化钡,Barium oxide;99.99% trace metals basis
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氢氧化钠,Sodium hydroxide;pellets, semiconductor grade, 99.99% trace metals basis
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地黄苦苷,Rehmapicroside;≥98%
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Dowex® 50WX8氢型强酸性阳离子交换树脂,Dowex® 50W X8;hydrogen form, strongly acidic, 50-100 mesh
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辛基三甲氧基硅烷,Trimethoxy(octyl)silane [TMOS];96%