甲磺酸乙酯,Ethyl methanesulfonate [EMS];liquid
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萘啶酸 [萘啶酮酸],Nalidixic acid;≥98%
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氧化铜,Copper(II) oxide;powder EMPLURA®, ≥96.0% (complexometric)
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吐温80,TWEEN ® 80;viscous liquid, Low-peroxide
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硝酸镱(III)五水合物,Ytterbium(III) nitrate pentahydrate;99.999%
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十六烷基膦酸,Hexadecylphosphonic acid [HDPA];97%
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酒石酸铜(II)水合物,Copper(II) tartrate hydrate;99.9% trace metals basis