对羟基苯甲酸丙酯钠盐,Propyl 4-hydroxybenzoate sodium salt;tested according to Ph. Eur.
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硅,Silicon;wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.3 mm
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氧化铟锡,Indium tin oxide [ITO];−325 mesh, ≥99.99% trace metals basis
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氧化钴(II,III) [四氧化三钴],Cobalt(II,III) oxide;≥99.99% trace metals basis
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曲拉通X100,Triton™ X-100;BioXtra
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聚肌苷酸-聚胞苷酸钾盐,Polyinosinic–polycytidylic acid potassium salt;with buffer salts, TLR ligand tested
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黄原胶 (来源于野油菜黄单胞菌),Xanthan gum from Xanthomonas campestris